81
TITLE: In situ TEM study of grain growth in nanocrystalline copper thin films  Full Text
AUTHORS: Simoes, S ; Calinas, R; Vieira, MT ; Vieira, Manuel ; Ferreira, PJ;
PUBLISHED: 2010, SOURCE: NANOTECHNOLOGY, VOLUME: 21, ISSUE: 14
INDEXED IN: Scopus WOS CrossRef: 104
82
TITLE: Reaction-assisted diffusion bonding of advanced materials
AUTHORS: Ramos, AS ; Vieira, MT; Simoes, S ; Viana, Filomena ; Vieira, Manuel ;
PUBLISHED: 2010, SOURCE: Defect and Diffusion Forum, VOLUME: 297-301
INDEXED IN: Scopus CrossRef: 17
83
TITLE: Solid-state diffusion bonding of TiAl by nanostructured materials
AUTHORS: Simoes, S ; Viana, Filomena ; Ventzke, V; Kocak, M; Ramos, AS ; Vieira, MT; Vieira, Manuel ;
PUBLISHED: 2010, SOURCE: International Conference on Advances in Welding Science and Technology for Construction, Energy and Transportation, AWST 2010, held in Conjunction with the 63rd Annual Assembly of the International Institute of Welding, IIW 2010 in Proc. of the Int. Conf. on Advances in Welding Science and Technology for Construction, Energy and Transportation, AWST 2010, held in Conj. with the 63rd Annual Assembly of IIW 2010
INDEXED IN: Scopus
IN MY: ORCID
84
TITLE: TEM Characterization of As-Deposited and Annealed Ni/Al Multilayer Thin Film
AUTHORS: Simoes, S ; Viana, Filomena ; Ramos, AS ; Vieira, MT ; Vieira, Manuel ;
PUBLISHED: 2010, SOURCE: MICROSCOPY AND MICROANALYSIS, VOLUME: 16, ISSUE: 6
INDEXED IN: Scopus WOS CrossRef: 9
85
TITLE: Intermixing in Ni/Al multilayer thin films
AUTHORS: Simoes, S ; Viana, Filomena ; Ramos, AS; Vieira, MT; Vieira, Manuel ;
PUBLISHED: 2009, SOURCE: Microscopy and Microanalysis, VOLUME: 15, ISSUE: SUPPL.3
INDEXED IN: Scopus CrossRef: 4
86
TITLE: Joining of Superalloys to Intermetallics Using Nanolayers
AUTHORS: Ramos, AS ; Vieira, MT ; Simoes, S ; Viana, Filomena ; Vieira, Manuel ;
PUBLISHED: 2009, SOURCE: 1st International Conference on New Materials for Extreme Environments in 1ST INTERNATIONAL CONFERENCE ON NEW MATERIALS FOR EXTREME ENVIRONMENTS, VOLUME: 59
INDEXED IN: Scopus WOS CrossRef: 39
87
TITLE: Joining of TiAl alloys using Ni/Al multilayers
AUTHORS: Simoes, S ; Viana, Filomena ; Ventzke, V; Kocak, M; Ramos, AS; Vieira, MT; Vieira, Manuel ;
PUBLISHED: 2009, SOURCE: Microscopy and Microanalysis, VOLUME: 15, ISSUE: SUPPL.3
INDEXED IN: Scopus CrossRef
88
TITLE: Production of intermetallic compounds from Ti/Al and Ni/Al multilayer thin films-A comparative study  Full Text
AUTHORS: Ramos, AS ; Vieira, MT ; Morgiel, J; Grzonka, J; Simoes, S ; Vieira, Manuel ;
PUBLISHED: 2009, SOURCE: JOURNAL OF ALLOYS AND COMPOUNDS, VOLUME: 484, ISSUE: 1-2
INDEXED IN: Scopus WOS CrossRef: 64
89
TITLE: Effect of Annealing Conditions on the Grain Size of Nanocrystalline Copper Thin Films
AUTHORS: Simoes, S ; Calinas, R; Ferreira, PJ; Vieira, MT ; Viana, Filomena ; Vieira, Manuel ;
PUBLISHED: 2008, SOURCE: 13th Conference of the Sociedade-Portuguesa-de-Materiais/4th International Materials Symposium in ADVANCED MATERIALS FORUM IV, VOLUME: 587-588
INDEXED IN: Scopus WOS
90
TITLE: Effect of Annealing Conditions on the Grain Size of Nanocrystalline Copper Thin Films
AUTHORS: Sonia Simões ; Rosa Calinas; P.J Ferreira; Teresa T Vieira; Viana, Filomena ; Vieira, Manuel ;
PUBLISHED: 2008, SOURCE: Materials Science Forum, VOLUME: 587-588
INDEXED IN: CrossRef: 7
IN MY: ORCID
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