António Bernardo Mendes de Seiça da Providência Santarém
AuthID: R-000-1Y9
11
TITLE: DESIGN AS A NON-FORMAL EDUCATIONAL TOOL
AUTHORS: Rita Brandao; Bernardo Providencia; Ligia Lopes;
PUBLISHED: 2019, SOURCE: 3rd International Conference on Design and Digital Communication (DIGICOM) in DIGICOM 2019 - 3RD INTERNATIONAL CONFERENCE ON DESIGN AND DIGITAL COMMUNICATION
AUTHORS: Rita Brandao; Bernardo Providencia; Ligia Lopes;
PUBLISHED: 2019, SOURCE: 3rd International Conference on Design and Digital Communication (DIGICOM) in DIGICOM 2019 - 3RD INTERNATIONAL CONFERENCE ON DESIGN AND DIGITAL COMMUNICATION
INDEXED IN: 
WOS
WOS12
TITLE: Piezoresistive polymer accelerometer
AUTHORS: Martins, LF; Silva, CS; Mendes, B; Azevedo, M; Pontes, AJ; Rocha, LA;
PUBLISHED: 2014, SOURCE: 28th European Conference on Solid-State Transducers (EUROSENSORS) in 28TH EUROPEAN CONFERENCE ON SOLID-STATE TRANSDUCERS (EUROSENSORS 2014), VOLUME: 87
AUTHORS: Martins, LF; Silva, CS; Mendes, B; Azevedo, M; Pontes, AJ; Rocha, LA;
PUBLISHED: 2014, SOURCE: 28th European Conference on Solid-State Transducers (EUROSENSORS) in 28TH EUROPEAN CONFERENCE ON SOLID-STATE TRANSDUCERS (EUROSENSORS 2014), VOLUME: 87
13
TITLE: DESIGN, SEDUCTION AND FASHION PRODUCTS
AUTHORS: Ana Paula Faria; Joana Cunha; Bernardo Providencia;
PUBLISHED: 2014, SOURCE: International Multidisciplinary Scientific Conferences on Social Sciences and Arts (SGEM 2014) in ARTS, PERFORMING ARTS, ARCHITECTURE AND DESIGN
AUTHORS: Ana Paula Faria; Joana Cunha; Bernardo Providencia;
PUBLISHED: 2014, SOURCE: International Multidisciplinary Scientific Conferences on Social Sciences and Arts (SGEM 2014) in ARTS, PERFORMING ARTS, ARCHITECTURE AND DESIGN
INDEXED IN: WOS
WOS14
TITLE: Interface tool for human communication to integrate psychophysical inputs with rapid manufacturing technologies Full Text
AUTHORS: Providência, B; Ciurana, J;
PUBLISHED: 2010, SOURCE: International Journal of Computer Integrated Manufacturing, VOLUME: 23, ISSUE: 8-9
AUTHORS: Providência, B; Ciurana, J;
PUBLISHED: 2010, SOURCE: International Journal of Computer Integrated Manufacturing, VOLUME: 23, ISSUE: 8-9
