11
TITLE: Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide-EMC, Polyimide-SiO2, and Silicon-EMC) Found in Microchips  Full Text
AUTHORS: Videira, Pedro F. C.; Ferreira, Renato A.; Maleki, Payam; Akhavan Safar, Alireza; Carbas, Ricardo J. C.; Marques, Eduardo A. S.; Karunamurthy, Bala; da Silva, Lucas F. M.;
PUBLISHED: 2025, SOURCE: POLYMERS, VOLUME: 17, ISSUE: 4
INDEXED IN: Scopus WOS CrossRef
IN MY: ORCID
12
TITLE: Special issue: 5th international conference on materials design and applications 2024 (MDA 2024)
AUTHORS: da Silva, Lucas F. M.;
PUBLISHED: 2025, SOURCE: PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS
INDEXED IN: WOS CrossRef
IN MY: ORCID
13
TITLE: Improving Eco-Friendly Polymer Adhesive Joints: Innovative Toughening Strategies for Consistent Performance Under Various Loading Conditions  Full Text
AUTHORS: Jalali, Shahin; Carbas, Ricardo J. C.; Marques, Eduardo A. S.; da Silva, Lucas F. M.;
PUBLISHED: 2025, SOURCE: POLYMERS, VOLUME: 17, ISSUE: 5
INDEXED IN: Scopus WOS CrossRef
IN MY: ORCID
14
TITLE: Special issue: 5th international conference on materials design and applications 2024 (MDA 2024)
AUTHORS: Lucas M da Silva;
PUBLISHED: 2025, SOURCE: Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications
INDEXED IN: Scopus
15
TITLE: Special issue: 5th international conference on materials design and applications 2024 (MDA 2024)
AUTHORS: Lucas M da Silva;
PUBLISHED: 2025, SOURCE: Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications, VOLUME: 239, ISSUE: 4
INDEXED IN: Scopus
16
TITLE: Strength improvement/optimization methods in adhesively bonded joints: A comprehensive review of past and present techniques  Full Text
AUTHORS: Ejaz, Hassan; Awan, M. Awais; Muzzammil, H. M.; Ullah, Mateen; Akhavan Safar, A.; da silva, L. F. M.; Tanveer, Ahsan;
PUBLISHED: 2024, SOURCE: MECHANICS OF ADVANCED MATERIALS AND STRUCTURES
INDEXED IN: Scopus WOS CrossRef
IN MY: ORCID
17
TITLE: Void detection in structural adhesive joints using a k-Nearest Neighbors model with features from Electromechanical Impedance Spectroscopy
AUTHORS: Pedro A O Vilela; Francisco F G.; António F M Mendes Lopes ; Lucas F M Da Silva;
PUBLISHED: 2024, SOURCE: Engineering Manufacturing Letters, VOLUME: 2, ISSUE: 1
INDEXED IN: CrossRef
IN MY: ORCID
18
TITLE: Characterization of the mechanical properties of a polyurethane adhesive: Tensile strength and Fracture tests
AUTHORS: Maria Ribas; Henrique Oliveira; Alireza Akhavan-Safar; Ricardo Carbas; Eduardo Marques; Sabine Wenig; Lucas Silva;
PUBLISHED: 2024, SOURCE: Engineering Manufacturing Letters, VOLUME: 2, ISSUE: 1
INDEXED IN: CrossRef
IN MY: ORCID
19
TITLE: Editorial of the 2nd issue of Engineering Manufacturing Letters
AUTHORS: Lucas F M Silva; Ricardo Carbas;
PUBLISHED: 2024, SOURCE: Engineering Manufacturing Letters, VOLUME: 2, ISSUE: 1
INDEXED IN: CrossRef
IN MY: ORCID
20
TITLE: A novel joining technology for hybrid busbars in electric vehicle batteries
AUTHORS: da Costa, D. P. M.; Kasaei, M. M.; Carbas, R. J. C.; Marques, E. A. S.; da Silva, L. F. M.;
PUBLISHED: 2024, SOURCE: THIN-WALLED STRUCTURES, VOLUME: 205
INDEXED IN: Scopus WOS CrossRef: 1
IN MY: ORCID
Page 2 of 3. Total results: 29.