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TITLE: Modelling of Voids Closure in the Diffusion Bonding Process
AUTHORS: Alegria, J; Miranda, RM ; Gomez M G de Salazar; Fernandes, AA ;
PUBLISHED: 2008, SOURCE: 13th Conference of the Sociedade-Portuguesa-de-Materiais/4th International Materials Symposium in ADVANCED MATERIALS FORUM IV, VOLUME: 587-588
INDEXED IN: Scopus WOS