T. Daubenspeck


AuthID: R-00J-D4C

Publications Awaiting Confirmation

1
TITLE: Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies  Full Text
AUTHORS: Augur, R; Child, C; Ahn, JH; Tang, TJ; Clevenger, L; Kioussis, D; Masuda, H; Srivastava, R; Oda, Y; Oguma, H; Quon, R; Kim, B; Sheng, H; Hirooka, S; Gupta, R; Thomas, A; Singh, SM; Fang, Q; Schiwon, R; Hamieh, B; Wornyo, E; Allen, S; Kaltalioglu, E; Ribes, G; Zhang, G; Fryxell, T; Ogino, A; Shimada, E; Aizawa, H; Minda, H; Kim, SO; Oki, T; Fujii, K; Pallachalil, M; Takewaki, T; Hu, CK; Sundlof, B; Permana, D; Bolom, T; Engel, B; Labelle, C; Sapp, B; Nogami, T; Simon, A; Shobha, H; Gates, S; Ryan, ET; Bonilla, G; Daubenspeck, T; Shaw, T; Osborne, G; Grill, A; Edelstein, D; Restaino, D; Molis, S; Spooner, T; Ferreira, P ; Biery, G; Sampson, R; ...More
PUBLISHED: 2012, SOURCE: Microelectronic Engineering, VOLUME: 92
INDEXED IN: Scopus CrossRef: 2

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