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TITLE: A Hybrid Panel Level Package (Hybrid PLP) Technology Based on a 650-mm x 650-mm Platform
AUTHORS: O'Toole, Eoin; Silva, Jose Luis; Cardoso, Filipe; Silva, Jose; Alves, Luis; Souto, Marcio; Delduque, Nuno; Coelho, Anibal; Silva, Jose Miguel; Do, WonChul; Khim, JinYoung;
PUBLISHED: 2022, SOURCE: 72nd IEEE Electronic Components and Technology Conference (ECTC) in IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), VOLUME: 2022-May
INDEXED IN: Scopus WOS