Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder

AuthID
 P-00Y-YD7
8
Author(s)
Barros D.A.
·
Teixeira J.C.
·
Macedo F.
Document Type
Proceedings Paper
Year published
2018
Published
in ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume: 12
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Publication Identifiers
Scopus: 2-s2.0-85060372892
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