Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies

AuthID
 P-00Z-9ZD
7
Author(s)
Leite, TM
·
Delgado, I
Document Type
Article
Year published
2023
Published
in SENSORS, ISSN: 1424-8220
Volume: 23, Issue: 20
Indexing
Wos®
Scopus®
Pubmed®
Google Scholar®
Publication Identifiers
Pubmed: 37896659
Scopus: 2-s2.0-85175272782
Wos: WOS:001095530000001
Source Identifiers
ISSN: 1424-8220
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