Influence Of The Microstructure On The Creep Behaviour Of Tin-Silver Copper Solder

AuthID
 P-019-GSM
8
Author(s)
Ribeiro, PE
·
Soares, DF
·
Barros, DA
·
Capela, P
·
Document Type
Proceedings Paper
Year published
2019
Published
in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2018, VOL 12
Volume: 12
Conference
Asmeinternational Mechanical Engineering Congress and Exposition (Imece2018), Date: NOV 09-15, 2018, Location: Pittsburgh, PA, Sponsors: Amer Soc Mech Engineers
Indexing
Wos®
Scopus®
Crossref®
Handle®
Google Scholar®
Publication Identifiers
Scopus: 2-s2.0-85060372892
Wos: WOS:000465192900023
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