Inter-Die Hybrid Cu/Diamond Microbump Bonding for 3D Heterogenous Integration

AuthID
 P-019-RB0
9
Author(s)
Chen, ZW
·
Kyatam, S
·
Wang, KY
·
Opondo, N
·
Oliveira, R
·
Li, J
·
Wei, TW
Document Type
Proceedings Paper
Year published
2025
Published
in 2025 IEEE 75TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC in Electronic Components and Technology Conference, ISSN: 0569-5503
Pages: 351-356 (6)
Conference
75Th Electronic Components and Technology Conference-Ectc-Annual, Date: MAY 27-30, 2025, Location: Dallas, TX
Indexing
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Publication Identifiers
Scopus: 2-s2.0-105010603611
Wos: WOS:001537918100059
Source Identifiers
ISSN: 0569-5503
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