in 2012 IEEE 21ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS in IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS, ISSN: 2165-4107
Pages: 224-227 (4)
Conference
Ieee 21St Conference on Electrical Performance of Electronic Packaging and Systems (Epeps), Date: OCT 21-24, 2012, Location: Tempe, AZ, Sponsors: IEEE, IEEE Microwave Theory & Tech Soc, IEEE Components, Packaging & Mfg Technol Soc, Ansys Inc, Cadence Design Syst Inc, 3DIC Res Ctr, Agilent Technologies Inc, ASE Grp, E Syst Design Inc, IBM Res, IdemWorks s r l, Nimbic Inc
