Characterization of High-Resistivity Polycrystalline Silicon Substrates for Wafer-Level Packaging and Integration of Rf Passives

AuthID
P-007-EFT
6
Author(s)
Bartek, M
·
Polyakov, A
·
Sinaga, SM
·
Burghartz, JN
1
Editor(s)
Osvald J.Hascik S.Osvald J.Hascik S.
Document Type
Proceedings Paper
Year published
2004
Published
in ASDAM 2004 - Conference Proceedings, 5th International Conference on Semiconductor Devices and Microsystmes
Pages: 227-230
Conference
Asdam 2004 - 5Th International Conference on Semiconductor Devices and Microsystmes, Date: 17 October 2004 through 21 October 2004, Location: Smolenics Castle, Sponsors: Commission of the European Communities;IEEE Electron Devices Society
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Publication Identifiers
Scopus: 2-s2.0-28844481087
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