Stress Assisted Grain Growth and Dielectric Properties of Bala 4Ti4O15 Thick Films

AuthID
 P-008-AWK
5
Author(s)
Jamin, C
·
Guillon, O
·
Document Type
Proceedings Paper
Year published
2012
Published
in Proceedings - IMAPS/ACerS 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2012
Pages: 542-548
Conference
8Th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Cicmt 2012, Date: 16 April 2012 through 19 April 2012, Location: Erfurt, Sponsors: International Microelectronics and Packaging Society (IMAPS);The American Ceramic Society (ACerS);IMAPS Deutschland;Inst. Micro-Nanotechnologies MacroNano Ilmenau Univ. Technol.;Mikro-Nano-Thuringen e.V. (MNT)
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Scopus®
Publication Identifiers
Scopus: 2-s2.0-84877749243
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