Efficient Frequency-Domain Modeling And Circuit Simulation Of Transmission-Lines

AuthID
 P-009-0JF
5
Author(s)
ELFADEL, IM
·
WHITE, JK
·
CHILUKURI, M
·
KUNDERT, KS
Document Type
Article
Year published
1994
Published
in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, ISSN: 1070-9894
Volume: 17, Issue: 4, Pages: 505-513 (9)
Conference
Ieee 2Nd Topical Meeting on the Electrical Performance of Electronic Packaging, Date: OCT, 1993, Location: MONTEREY, CA, Sponsors: IEEE, MICROWAVE THEORY & TECH SOC, IEEE, COMPONENTS PACKAGING & MFG TECHNOL SOC
Indexing
Wos®
Scopus®
Google Scholar®
Publication Identifiers
Scopus: 2-s2.0-0028543304
Wos: WOS:A1994PY29200007
Source Identifiers
ISSN: 1070-9894
Export Publication Metadata
Marked List
 Add to Marked List
Info
At this moment we don't have any links to full text documens.

A place for researchers and their institutions

Useful Links

Get Help

© 2024 CRACS & Inesc TEC - All Rights Reserved Privacy Policy | Terms of Service