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Role of Soldering Parameters on the Electrical Performances Presented by Cu-Sn-Cu Joints Used in Power Diodes

AuthID
P-000-YZM

Author(s)

Martins, R

Goncalves, C

Marvao, AP

Document Type

Article

Year published

2000

Published

in MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, ISSN: 0921-5093

Volume: 288, Issue: 2, Pages: 275-279 (5)

Conference

Joint Fems Symposium/E-Mrs Symposium H Strain in Materials: Analysis, Relatation and Properties, Date: JUN 01-04, 1999, Location: STRASBOURG, FRANCE

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Publication Identifiers

DOI: 10.1016/s0921-5093(00)00871-6

Scopus: 2-s2.0-0034272895

Wos: WOS:000088607600033

Source Identifiers

ISSN: 0921-5093

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Role of Soldering Parameters on the Electrical Performances Presented by Cu-Sn-Cu Joints Used in Power Diodes

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Role of Soldering Parameters on the Electrical Performances Presented by Cu-Sn-Cu Joints Used in Power Diodes

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