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Cu3Teo6Dielectric Thick Films: Processing by Electrophoretic Deposition and Electrical Characterization

AuthID
P-00G-QW3

Author(s)

Zhu, X

Wang, Z

Vilarinho, PM

Editor(s)

Boccaccini,AR;Biest,O;Uchikoshi,T;Dickerson,JH;Ferrari,B

Document Type

Proceedings Paper

Year published

2015

Published

in Key Engineering Materials, ISSN: 1013-9826

Volume: 654, Pages: 114-121

Conference

5Th International Conference on Electrophoretic Deposition: Fundamentals and Applications, Epd 2014, Date: 5 October 2014 through 10 October 2014, Sponsors: Engineering Conferences International (ECI)

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Publication Identifiers

DOI: 10.4028/www.scientific.net/kem.654.114

Handle: https://hdl.handle.net/10773/20550

Scopus: 2-s2.0-84944322619

Source Identifiers

ISSN: 1013-9826

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