Implementation of Keep-Out-Zones to Protect Sensitive Sensor Areas During Backend Processing in Wafer Level Packaging Technology

AuthID
P-00K-WC2
7
Author(s)
Cardoso, A
·
Pires, M
·
Fernades, E
·
Barros, I
·
Kuisma, H
·
Nurmi, S
Document Type
Proceedings Paper
Year published
2016
Published
in 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) in Electronic Components and Technology Conference, ISSN: 0569-5503
Volume: 2016-August, Pages: 1160-1166 (7)
Conference
66Th Ieee Electronic Components and Technology Conference (Ectc), Date: MAY 31-JUN 03, 2016, Location: Las Vegas, NV, Sponsors: IEEE, IEEE Components Packaging & Mfg Technol Soc
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Publication Identifiers
Scopus: 2-s2.0-84987816137
Wos: WOS:000386103500169
Source Identifiers
ISSN: 0569-5503
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