Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (In Wt.%) Lead-Free Solder Paste and Various Substrates

AuthID
 P-00P-XSH
9
Author(s)
Leitao, H
·
Lau, CS
·
Ribas, L
·
Document Type
Article
Year published
2018
Published
in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, ISSN: 1059-9495
Volume: 27, Issue: 10, Pages: 5011-5017 (7)
Conference
European Congress and Exhibition on Advanced Materials and Processes (Euromat), Date: SEP 17-22, 2017, Location: Thessaloniki, GREECE
Indexing
Wos®
Scopus®
Crossref®5
Google Scholar®
Publication Identifiers
Scopus: 2-s2.0-85047664049
Wos: WOS:000450714400006
Source Identifiers
ISSN: 1059-9495
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