Low-Density Fan-Out Sip for Wearables and Iot with Heterogeneous Integration

AuthID
P-00Q-4YE
11
Author(s)
Martins, A
·
Ferreira, AF
·
Almeida, R
·
Matos, F
·
Oliveira, J
·
O'Toole, E
·
Monteiro, MC
·
Silva, RP
Document Type
Proceedings Paper
Year published
2018
Published
in 2018 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC)
Conference
International Wafer Level Packaging Conference (Iwlpc), Date: OCT 23-25, 2018, Location: San Jose, CA
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Publication Identifiers
Scopus: 2-s2.0-85060450899
Wos: WOS:000462176800015
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