Influence Of The Microstructure On The Creep Behaviour Of Tin-Silver Copper Solder

AuthID
 P-00Q-J83
8
Author(s)
Document Type
Proceedings Paper
Year published
2019
Published
in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2018, VOL 12
Conference
Asmeinternational Mechanical Engineering Congress and Exposition (Imece2018), Date: NOV 09-15, 2018, Location: Pittsburgh, PA, Sponsors: Amer Soc Mech Engineers
Indexing
Wos®
Publication Identifiers
Wos: WOS:000465192900023
Export Publication Metadata
Marked List
 Add to Marked List
Info
At this moment we don't have any links to full text documens.

A place for researchers and their institutions

Useful Links

Get Help

© 2024 CRACS & Inesc TEC - All Rights Reserved Privacy Policy | Terms of Service