Influence Of The Applied Load On The Creep Behaviour Of Tin-Silver-Copper Solder

AuthID
 P-00R-PZ7
8
Author(s)
Barros, DA
·
Macedo, F
·
Document Type
Proceedings Paper
Year published
2020
Published
in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2019, VOL 12: ADVANCED MATERIALS: DESIGN, PROCESSING, CHARACTERIZATION, AND APPLICATIONS
Volume: 12
Conference
Asme International Mechanical Engineering Congress and Exposition (Imece), Date: NOV 08-14, 2019, Location: Salt Lake City, UT, Sponsors: ASME
Indexing
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Scopus®
Crossref®
Google Scholar®
Publication Identifiers
Scopus: 2-s2.0-85078756978
Wos: WOS:000623518500025
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