Competitive and Cost Effective Copper/Low-K Interconnect (Beol) for 28Nm Cmos Technologies

AuthID
P-00S-32B
55
Author(s)
Augur, R
·
Child, C
·
Ahn, JH
·
Tang, TJ
·
Clevenger, L
·
Kioussis, D
·
Masuda, H
·
Srivastava, R
·
Oda, Y
·
Oguma, H
·
[+35]·
Shaw, T
·
Osborne, G
·
Grill, A
·
Edelstein, D
·
Restaino, D
·
Molis, S
·
Spooner, T
·
Biery, G
·
Sampson, R
Document Type
Proceedings Paper
Year published
2010
Published
in Advanced Metallization Conference (AMC), ISSN: 1540-1766
Pages: 41-42
Conference
Advanced Metallization Conference 2010, Date: 5 October 2010 through 7 October 2010, Location: Albany, NY
Indexing
Publication Identifiers
Scopus: 2-s2.0-79957664080
Source Identifiers
ISSN: 1540-1766
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Name Order Name   Name Order Name   Name Order Name
1 Augur, R;   2 Child, C;   3 Ahn, JH;
4 Tang, TJ;   5 Clevenger, L;   6 Kioussis, D;
7 Masuda, H;   8 Srivastava, R;   9 Oda, Y;
10 Oguma, H;   11 Quon, R;   12 Kim, B;
13 Sheng, H;   14 Hirooka, S;   15 Gupta, R;
16 Thomas, A;   17 Singh, SM;   18 Fang, Q;
19 Schiwon, R;   20 Hamieh, B;   21 Wornyo, E;
22 Allen, S;   23 Kaltalioglu, E;   24 Fryxell, T;
25 Ogino, A;   26 Shimada, E;   27 Aizawa, H;
28 Minda, H;   29 Kim, SO;   30 Oki, T;
31 Fujii, K;   32 Pallachalil, M;   33 Takewaki, T;
34 Hu, CK;   35 Sundloff, B;   36 Permana, D;
37 Bolom, T;   38 Engel, B;   39 Labelle, C;
40 Sapp, B;   41 Shobha, H;   42 Gates, S;
43 Ryan, ET;   44 Bonilla, G;   45 Daubenspeck, T;
46 Shaw, T;   47 Osborne, G;   48 Grill, A;
49 Edelstein, D;   50 Restaino, D;   51 Molis, S;
52 Spooner, T;   53 Ferreira, P ;   54 Biery, G;
55 Sampson, R;