Air-Cooled Loop Thermosyphon Cooling System for High Heat Load Cpus-Part I: Design and Performance Simulation

AuthID
 P-00V-NJ8
5
Author(s)
Armas, GSRB
·
Thome, JR
·
Zhang, LW
Document Type
Article
Year published
2021
Published
in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, ISSN: 2156-3950
Volume: 11, Issue: 10, Pages: 1679-1686 (8)
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Publication Identifiers
Wos: WOS:000712564200018
Source Identifiers
ISSN: 2156-3950
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