Air-Cooled Loop Thermosyphon Cooling System for High Heat Load Cpus-Part Ii: Experimental Results and Validation

AuthID
 P-00V-NJ9
5
Author(s)
Armas, GSRB
·
Thome, JR
·
Zhang, LW
Document Type
Article
Year published
2021
Published
in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, ISSN: 2156-3950
Volume: 11, Issue: 10, Pages: 1687-1694 (8)
Indexing
Wos®
Google Scholar®
Publication Identifiers
Wos: WOS:000712564200019
Source Identifiers
ISSN: 2156-3950
Export Publication Metadata
Marked List
 Add to Marked List
Info
At this moment we don't have any links to full text documens.

A place for researchers and their institutions

Useful Links

Get Help

© 2024 CRACS & Inesc TEC - All Rights Reserved Privacy Policy | Terms of Service