Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis

AuthID
 P-00W-JTG
5
Author(s)
Oliveira, BMC
·
Document Type
Article
Year published
2022
Published
in NANOMATERIALS
Volume: 12, Issue: 10, Pages: 1752 (15)
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Publication Identifiers
Pubmed: 35630972
Wos: WOS:000803205000001
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