ProfileOfResearchers

TÃTULO: Study and development of micro hot embossing on 316l/polymer mixtures
AUTORES: Sequeiros, EW ; Ferreira, TJ; Vieira, MT; Vieira, Manuel ;
PUBLICAÇÃO: 2011, FONTE: European International Powder Metallurgy Congress and Exhibition, Euro PM 2011 in Proceedings of the Euro International Powder Metallurgy Congress and Exhibition, Euro PM 2011, VOLUME: 2

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104

TÃTULO: Brazing Ti-47Al-2Cr-2Nb to Inconel 718 with different filler alloys: Microstructural characterization of the interfaces
AUTORES: Guedes, A; Mollaoglu, H; Viana, Filomena ; Pinto, AMP; Vieira, Manuel ;
PUBLICAÇÃO: 2010, FONTE: International Conference on Advances in Welding Science and Technology for Construction, Energy and Transportation, AWST 2010, held in Conjunction with the 63rd Annual Assembly of the International Institute of Welding, IIW 2010 in Proc. of the Int. Conf. on Advances in Welding Science and Technology for Construction, Energy and Transportation, AWST 2010, held in Conj. with the 63rd Annual Assembly of IIW 2010

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105

TÃTULO: Developments in diffusion bonding and brazing of advanced materials
AUTORES: Vieira, Manuel ; Vieira, MT; Ramos, AS ; Simoes, S ; Viana, Filomena ;
PUBLICAÇÃO: 2010, FONTE: International Conference on Advances in Welding Science and Technology for Construction, Energy and Transportation, AWST 2010, held in Conjunction with the 63rd Annual Assembly of the International Institute of Welding, IIW 2010 in Proc. of the Int. Conf. on Advances in Welding Science and Technology for Construction, Energy and Transportation, AWST 2010, held in Conj. with the 63rd Annual Assembly of IIW 2010

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106

TÃTULO: Diffusion bonding of TiAl using Ni/Al multilayers Full Text
AUTORES: Sonia Simoes ; Viana, Filomena ; Volker Ventzke; Mustafa Kocak; Sofia S Ramos ; Teresa T Vieira ; Vieira, Manuel ;
PUBLICAÇÃO: 2010, FONTE: Conference on High-Temperature Joining (EUROMAT 2009) in JOURNAL OF MATERIALS SCIENCE, VOLUME: 45, NÚMERO: 16

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TÃTULO: In situ TEM study of grain growth in nanocrystalline copper thin films Full Text
AUTORES: Simoes, S ; Calinas, R; Vieira, MT ; Vieira, Manuel ; Ferreira, PJ;
PUBLICAÇÃO: 2010, FONTE: NANOTECHNOLOGY, VOLUME: 21, NÚMERO: 14

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TÃTULO: Reaction-assisted diffusion bonding of advanced materials
AUTORES: Ramos, AS ; Vieira, MT; Simoes, S ; Viana, Filomena ; Vieira, Manuel ;
PUBLICAÇÃO: 2010, FONTE: Defect and Diffusion Forum, VOLUME: 297-301

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TÃTULO: Solid-state diffusion bonding of TiAl by nanostructured materials
AUTORES: Simoes, S ; Viana, Filomena ; Ventzke, V; Kocak, M; Ramos, AS ; Vieira, MT; Vieira, Manuel ;
PUBLICAÇÃO: 2010, FONTE: International Conference on Advances in Welding Science and Technology for Construction, Energy and Transportation, AWST 2010, held in Conjunction with the 63rd Annual Assembly of the International Institute of Welding, IIW 2010 in Proc. of the Int. Conf. on Advances in Welding Science and Technology for Construction, Energy and Transportation, AWST 2010, held in Conj. with the 63rd Annual Assembly of IIW 2010

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110