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TÍTULO: Dataset for additional information on the evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr–O–N thin films
AUTORES: da Silva Oliveira, CI; Martinez Martinez, D; Couto, FM; Cunha, L ; Macedo, F ;
PUBLICAÇÃO: 2020, FONTE: Data in Brief, VOLUME: 29
INDEXADO EM: Scopus CrossRef
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TÍTULO: Fabrication, Characterization and Implementation of Thermo Resistive TiCu(N,O) Thin Films in a Polymer Injection Mold  Full Text
AUTORES: Oliveira, E; Silva, JP; Laranjeira, J; Macedo, F ; Lanceros Mendez, S ; Vaz, F ; Ferreira, A;
PUBLICAÇÃO: 2020, FONTE: MATERIALS, VOLUME: 13, NÚMERO: 6
INDEXADO EM: Scopus WOS CrossRef: 9 Handle
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TÍTULO: INFLUENCE OF THE APPLIED LOAD ON THE CREEP BEHAVIOUR OF TIN-SILVER-COPPER SOLDER
AUTORES: Soares, DF; Ribeiro, PE; Capela, P; Barros, DA; Cerqueira, MF ; S F C F Teixeira ; Macedo, F ; Teixeira, JC ;
PUBLICAÇÃO: 2020, FONTE: ASME International Mechanical Engineering Congress and Exposition (IMECE) in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2019, VOL 12: ADVANCED MATERIALS: DESIGN, PROCESSING, CHARACTERIZATION, AND APPLICATIONS, VOLUME: 12
INDEXADO EM: Scopus WOS CrossRef
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TÍTULO: Evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr-O-N thin films  Full Text
AUTORES: da Silva Oliveira, CI; Martinez Martinez, D; Couto, FM; Cunha, L ; Macedo, F ;
PUBLICAÇÃO: 2019, FONTE: 25th Congress of International-Federation-for-Heat-Treatment-and-Surface-Engineering (IFHTSE) in APPLIED SURFACE SCIENCE, VOLUME: 498
INDEXADO EM: Scopus WOS CrossRef: 1
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TÍTULO: Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates  Full Text
AUTORES: Soares, D; Leitao, H; Lau, CS; Teixeira, JC ; Ribas, L; Alves, R; S F C F Teixeira ; Cerqueira, MF ; Macedo, F ;
PUBLICAÇÃO: 2018, FONTE: European Congress and Exhibition on Advanced Materials and Processes (Euromat) in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, VOLUME: 27, NÚMERO: 10
INDEXADO EM: Scopus WOS CrossRef: 5
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TÍTULO: Contact angle measurement of SAC 305 solder: numerical and experimental approach  Full Text
AUTORES: Rodrigues, N ; Ferreira, AC ; S F C F Teixeira ; Soares, D ; Teixeira, JC ; Cerqueira, F ; Macedo, F ;
PUBLICAÇÃO: 2016, FONTE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 27, NÚMERO: 9
INDEXADO EM: Scopus WOS CrossRef: 8 Handle
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TÍTULO: Influence of Copper Layer Content in the Elastic and Damping Behavior of Glass-Fiber/Epoxy-Resin Composites  Full Text
AUTORES: Carneiro, VH; Capela, P; Teixeira, JC ; S F C F Teixeira ; Cerqueira, F ; Macedo, F ; Ribas, L; Soares, D ;
PUBLICAÇÃO: 2016, FONTE: APPLIED COMPOSITE MATERIALS, VOLUME: 23, NÚMERO: 6
INDEXADO EM: Scopus WOS CrossRef: 5 Handle
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TÍTULO: Evolution of the functional properties of titanium-silver thin films for biomedical applications: Influence of in-vacuum annealing  Full Text
AUTORES: Lopes, C; Goncalves, C; Borges, J ; Polcar, T; Rodrigues, MS; Barradas, NP ; Alves, E ; Le Bourhis, E; Couto, FM; Macedo, F ; Fonseca, C ; Vaz, F ;
PUBLICAÇÃO: 2015, FONTE: SURFACE & COATINGS TECHNOLOGY, VOLUME: 261
INDEXADO EM: Scopus WOS CrossRef Handle
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TÍTULO: MODELING THE REFLOW SOLDERING PROCESS IN PCB'S
AUTORES: Costa, J; Soares, D; S F C F Teixeira ; Cerqueira, F ; Macedo, F ; Rodrigues, N ; Ribas, L; Teixeira, JC ;
PUBLICAÇÃO: 2015, FONTE: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) in INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2, VOLUME: 2
INDEXADO EM: Scopus WOS CrossRef: 2
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TÍTULO: The influence of nitrogen and oxygen additions on the thermal characteristics of aluminium-based thin films  Full Text
AUTORES: Borges, J ; Macedo, F ; Couto, FM; Rodrigues, MS; Lopes, C; Pedrosa, P; Polcar, T; Marques, L ; Vaz, F ;
PUBLICAÇÃO: 2015, FONTE: MATERIALS CHEMISTRY AND PHYSICS, VOLUME: 163
INDEXADO EM: Scopus WOS CrossRef Handle
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