Maria de Fatima Guimaraes Cerqueira
AuthID: R-000-B1C
21
TITLE: INFLUENCE OF THE MICROSTRUCTURE ON THE CREEP BEHAVIOUR OF TIN-SILVER COPPER SOLDER
AUTHORS: Pedro E Ribeiro; Delfim F Soares; Maria F Cerqueira; S F C F Teixeira ; Daniel A Barros; Jose C Teixelra; Pauline Capela; Francisco Macedo;
PUBLISHED: 2019, SOURCE: ASMEInternational Mechanical Engineering Congress and Exposition (IMECE2018) in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2018, VOL 12
AUTHORS: Pedro E Ribeiro; Delfim F Soares; Maria F Cerqueira; S F C F Teixeira ; Daniel A Barros; Jose C Teixelra; Pauline Capela; Francisco Macedo;
PUBLISHED: 2019, SOURCE: ASMEInternational Mechanical Engineering Congress and Exposition (IMECE2018) in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2018, VOL 12
INDEXED IN: 
WOS
WOS22
TITLE: Negative thermoelectric power of melt mixed vapor grown carbon nanofiber polypropylene composites
AUTHORS: Paleo, AJ; Vieira, EMF; Wan, K; Bondarchuk, O; Cerqueira, MF; Goncalves, LM; Bilotti, E; Alpuim, P; Rocha, AM;
PUBLISHED: 2019, SOURCE: CARBON, VOLUME: 150
AUTHORS: Paleo, AJ; Vieira, EMF; Wan, K; Bondarchuk, O; Cerqueira, MF; Goncalves, LM; Bilotti, E; Alpuim, P; Rocha, AM;
PUBLISHED: 2019, SOURCE: CARBON, VOLUME: 150
INDEXED IN: 
Scopus WOS
Scopus WOS23
TITLE: Laser surface texturing of Ti-6Al-4V by nanosecond laser: Surface characterization, Ti-oxide layer analysis and its electrical insulation performance
AUTHORS: Moura, CG; Carvalho, O; Goncalves, LMV; Cerqueira, MF; Nascimento, R; Silva, F;
PUBLISHED: 2019, SOURCE: MATERIALS SCIENCE & ENGINEERING C-MATERIALS FOR BIOLOGICAL APPLICATIONS, VOLUME: 104
AUTHORS: Moura, CG; Carvalho, O; Goncalves, LMV; Cerqueira, MF; Nascimento, R; Silva, F;
PUBLISHED: 2019, SOURCE: MATERIALS SCIENCE & ENGINEERING C-MATERIALS FOR BIOLOGICAL APPLICATIONS, VOLUME: 104
INDEXED IN: Scopus WOS
Scopus WOS24
TITLE: Wafer scale fabrication of graphene microelectrode arrays for the detection of DNA hybridization Full Text
AUTHORS: Campos, R; Machado, G; Cerqueira, MF; Borme, J; Alpuim, P;
PUBLISHED: 2018, SOURCE: MICROELECTRONIC ENGINEERING, VOLUME: 189
AUTHORS: Campos, R; Machado, G; Cerqueira, MF; Borme, J; Alpuim, P;
PUBLISHED: 2018, SOURCE: MICROELECTRONIC ENGINEERING, VOLUME: 189
INDEXED IN: Scopus WOS
Scopus WOS25
TITLE: CREEP BEHAVIOR OF A SOLDER PASTE WITH BI ADDITION
AUTHORS: Ribeiro, PE; Soares, DF; Cerqueira, MF; S F C F Teixeira ; Barros, DA; Teixeira, JC;
PUBLISHED: 2018, SOURCE: ASME International Mechanical Engineering Congress and Exposition in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2017 VOL 14, VOLUME: 14
AUTHORS: Ribeiro, PE; Soares, DF; Cerqueira, MF; S F C F Teixeira ; Barros, DA; Teixeira, JC;
PUBLISHED: 2018, SOURCE: ASME International Mechanical Engineering Congress and Exposition in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2017 VOL 14, VOLUME: 14
26
TITLE: RHEOLOGY CHARACTERIZATION OF SOLDER PASTE
AUTHORS: Barbosa, FV; Ribeiro, PEA; Cerqueira, MF; Soares, DF; Teixeira, JCF; S F C F Teixeira ; Lima, RAMM ; Pinho, DMD;
PUBLISHED: 2018, SOURCE: ASME International Mechanical Engineering Congress and Exposition in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2017, VOL 7, VOLUME: 7
AUTHORS: Barbosa, FV; Ribeiro, PEA; Cerqueira, MF; Soares, DF; Teixeira, JCF; S F C F Teixeira ; Lima, RAMM ; Pinho, DMD;
PUBLISHED: 2018, SOURCE: ASME International Mechanical Engineering Congress and Exposition in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2017, VOL 7, VOLUME: 7
27
TITLE: Comparison of soybean hull pre-treatments to obtain cellulose and chemical derivatives: Physical chemistry characterization Full Text
AUTHORS: Paola Camiscia; Enrique D V Giordano; Emilia E Brassesco; Pablo Fucinos; Lorenzo Pastrana; Cerqueira, MF; Guillermo A Pico; Nadia Woitovich Valetti;
PUBLISHED: 2018, SOURCE: CARBOHYDRATE POLYMERS, VOLUME: 198
AUTHORS: Paola Camiscia; Enrique D V Giordano; Emilia E Brassesco; Pablo Fucinos; Lorenzo Pastrana; Cerqueira, MF; Guillermo A Pico; Nadia Woitovich Valetti;
PUBLISHED: 2018, SOURCE: CARBOHYDRATE POLYMERS, VOLUME: 198
INDEXED IN: Scopus WOS
Scopus WOS28
TITLE: Structural and vibrational properties of SnxGe1-x: Modeling and experiments Full Text
AUTHORS: Vasin, AS; Oliveira, F; Cerqueira, MF; Schulze, J; Vasilevskiy, MI;
PUBLISHED: 2018, SOURCE: JOURNAL OF APPLIED PHYSICS, VOLUME: 124, ISSUE: 3
AUTHORS: Vasin, AS; Oliveira, F; Cerqueira, MF; Schulze, J; Vasilevskiy, MI;
PUBLISHED: 2018, SOURCE: JOURNAL OF APPLIED PHYSICS, VOLUME: 124, ISSUE: 3
INDEXED IN: Scopus WOS
Scopus WOS29
TITLE: Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates Full Text
AUTHORS: Soares, D; Leitao, H; Lau, CS; Teixeira, JC; Ribas, L; Alves, R; S F C F Teixeira ; Cerqueira, MF; Macedo, F;
PUBLISHED: 2018, SOURCE: European Congress and Exhibition on Advanced Materials and Processes (Euromat) in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, VOLUME: 27, ISSUE: 10
AUTHORS: Soares, D; Leitao, H; Lau, CS; Teixeira, JC; Ribas, L; Alves, R; S F C F Teixeira ; Cerqueira, MF; Macedo, F;
PUBLISHED: 2018, SOURCE: European Congress and Exhibition on Advanced Materials and Processes (Euromat) in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, VOLUME: 27, ISSUE: 10
30
TITLE: Influence of the microstructure on the creep behaviour of tin-silver-copper solder
AUTHORS: Pedro E Ribeiro; Daniel A Barros; Delfim F Soares; José C Teixeira; Maria F Cerqueira; Pauline Capela; S F C F Teixeira ; Francisco Macedo;
PUBLISHED: 2018, SOURCE: ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), VOLUME: 12
AUTHORS: Pedro E Ribeiro; Daniel A Barros; Delfim F Soares; José C Teixeira; Maria F Cerqueira; Pauline Capela; S F C F Teixeira ; Francisco Macedo;
PUBLISHED: 2018, SOURCE: ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), VOLUME: 12
INDEXED IN: Scopus 
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