Ultra-Thick Films Using Single Spin Coated Commercial Photoresist: Challenges and Solutions

AuthID
P-00Z-KEP
3
Author(s)
Dante, A
·
Cardoso, A
Tipo de Documento
Proceedings Paper
Year published
2022
Publicado
in 2022 IEEE 9TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC
Páginas: 16-22 (7)
Conference
Ieee 9Th Electronics System-Integration Technology Conference (Estc), Date: SEP 13-16, 2022, Location: Sibiu, ROMANIA
Indexing
Publication Identifiers
Wos: WOS:001108538800004
Export Publication Metadata
Citações
Oops! It looks like you don't have access to this content.

This section is restricted to uses with b-on access.



CORE Conference
No information about CORE Rank

During the preprocessing phase, only publications of type 'Proceedings Paper' or 'Proceedings' are automatically processed to identify their CORE Rank.

TIP: If your publication's CORE Rank is missing, you can contact with your institutional manager to have the correct ranking manually added to the record.

Journal Factors
Oops! It looks like you don't have access to this content.

This section is restricted to uses with b-on access.

Info
At this moment we don't have any links to full text documens.