Ultra-Thick Films Using Single Spin Coated Commercial Photoresist: Challenges and Solutions

AuthID
 P-00Z-KEP
3
Author(s)
Dante, A
·
Cardoso, A
Document Type
Proceedings Paper
Year published
2022
Published
in 2022 IEEE 9TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC
Pages: 16-22 (7)
Conference
Ieee 9Th Electronics System-Integration Technology Conference (Estc), Date: SEP 13-16, 2022, Location: Sibiu, ROMANIA
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Publication Identifiers
Wos: WOS:001108538800004
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