Effect of Bonding Defects on Heat Transfer and Creep Response of Microprocessor-Heatsink Adhesive Joints

AuthID
 P-017-QN2
6
Author(s)
Gutiérrez-Posada, V
·
Akhavan-Safar, A
·
Simoes, BD
·
Tipo de Documento
Article
Year published
2025
Publicado
in JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, ISSN: 0957-4522
Volume: 36, Número: 1
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Publication Identifiers
SCOPUS: 2-s2.0-85213522259
Wos: WOS:001385847500007
Source Identifiers
ISSN: 0957-4522
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