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Application of Line-Scanning Microscopy Using a Linear Sensor in Semiconductor Industry: Shape and Thickness Measurements

AuthID
P-006-FVJ

Author(s)

Macedo, MP

Correia, CMBA

Editor(s)

Lehmann, PH; Osten, W; Albertazzi, A

Document Type

Proceedings Paper

Year published

2013

Published

in OPTICAL MEASUREMENT SYSTEMS FOR INDUSTRIAL INSPECTION VIII in Proceedings of SPIE, ISSN: 0277-786X

Volume: 8788

Conference

Conference on Optical Measurement Systems for Industrial Inspection Viii, Date: MAY 13-16, 2013, Location: Munich, GERMANY, Sponsors: SPIE

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Publication Identifiers

DOI: 10.1117/12.2020244

Scopus: 2-s2.0-84880744540

Wos: WOS:000323493700080

Source Identifiers

ISSN: 0277-786X

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Application of Line-Scanning Microscopy Using a Linear Sensor in Semiconductor Industry: Shape and Thickness Measurements

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