Influence of Temperature on the Curing of an Epoxy Adhesive and Its Influence on Bond Behaviour of Nsm-Cfrp Systems

AuthID
 P-00K-3DQ
5
Author(s)
Benedetti, A
·
Tipo de Documento
Article
Year published
2016
Publicado
in COMPOSITES PART B-ENGINEERING, ISSN: 1359-8368
Volume: 89, Páginas: 219-229 (11)
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Publication Identifiers
SCOPUS: 2-s2.0-84955496288
Wos: WOS:000371840100020
Source Identifiers
ISSN: 1359-8368
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