Thermo- Mechanical Challenges of Reflowed Lead-Free Solder Joints in Surface Mount Components: a Review

AuthID
 P-00K-DQ6
5
Author(s)
Lau, CS
·
Khor, CY
·
Abdullah, MZ
Tipo de Documento
Review
Year published
2016
Publicado
in SOLDERING & SURFACE MOUNT TECHNOLOGY, ISSN: 0954-0911
Volume: 28, Número: 2, Páginas: 41-62 (22)
Indexing
Wos®
Scopus®
Crossref®
Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-84964240520
Wos: WOS:000376207000001
Source Identifiers
ISSN: 0954-0911
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