Thermal State of Electronic Assemblies Applied to Smart Building Equipped with Qfn64 Device Subjected to Natural Convection

AuthID
 P-00M-K3F
5
Author(s)
Bairi, A
·
Martin Garin, A
·
Adeyeye, K
·
Millan Garcia, JA
Tipo de Documento
Article
Year published
2017
Publicado
in MICROELECTRONICS RELIABILITY, ISSN: 0026-2714
Volume: 70, Páginas: 79-83 (5)
Indexing
Wos®
Scopus®
Crossref®11
Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-85009775217
Wos: WOS:000395613500009
Source Identifiers
ISSN: 0026-2714
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