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Generating Compact, Guaranteed Passive Reduced-Order Models of 3-D Rlc Interconnects
AuthID
P-000-7W0
4
Author(s)
Marques, NA
·
Kamon, M
·
Silveira, LM
·
White, JK
Document Type
Article
Year published
2004
Published
in
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
ISSN: 1521-3323
Volume: 27, Issue: 4, Pages: 569-580 (12)
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Publication Identifiers
DOI
:
10.1109/tadvp.2004.831867
Scopus
: 2-s2.0-9244256783
Wos
: WOS:000224975400001
Source Identifiers
ISSN
: 1521-3323
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