Microwave-Assisted Organic Swelling Promotes Fast and Efficient Delamination of Waste Printed Circuit Boards

AuthID
 P-00T-PXH
5
Author(s)
Document Type
Article
Year published
2021
Published
in WASTE MANAGEMENT, ISSN: 0956-053X
Volume: 126, Pages: 231-238 (8)
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Wos®
Scopus®
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Pubmed®
Unpaywall®
Google Scholar®
Publication Identifiers
Pubmed: 33774583
Scopus: 2-s2.0-85103139484
Unpaywall: 10.1016/j.wasman.2021.03.012
Wos: WOS:000655586100023
Source Identifiers
ISSN: 0956-053X
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