Publicações

Experimental Evaluation and Simulation Validation of an Air-Cooled Loop Thermosyphon Designed for High Heat Load Cpus

AuthID
P-00V-H4Y

Author(s)

Armas, G

Rouaze, G

Marcinichen, JB

Thome, JR

Zhang, LW

Document Type

Proceedings Paper

Year published

2021

Published

in PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021) in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ISSN: 1936-3958

Volume: 2021-June, Pages: 65-73 (9)

Conference

20Th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm), Date: JUN 01-04, 2021, Location: ELECTR NETWORK, Sponsors: IEEE, IEEE Elect Packaging Soc, GE

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