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Thermal Analysis of Bending Under Tension Test
AuthID
P-00A-63K
P-00A-63K
3
Author(s)
2
Editor(s)
Ishikawa, T; Mori, KI
Document Type
Proceedings Paper
Year published
2014
Published
in 11TH INTERNATIONAL CONFERENCE ON TECHNOLOGY OF PLASTICITY, ICTP 2014 in Procedia Engineering, ISSN: 1877-7058
Volume: 81, Issue: C, Pages: 1805-1810 (6)
Conference
11Th International Conference on Technology of Plasticity (Ictp), Date: OCT 19-24, 2014, Location: Nagoya, JAPAN, Sponsors: Frontier Forming System Laboratory, Toyohashi University of Technology;Material Forming and Processing Laboratory, Nagoya University;The Japan Society for Technology of Plasticity
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ISSN: 1877-7058
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