Two-Phase Thermosiphon Cooling Using Integrated Heat Spreaders with Copper Microstructures

AuthID
 P-00P-E63
4
Author(s)
Abreu, V
·
Harrison, M
·
Gess, J
·
Document Type
Proceedings Paper
Year published
2018
Published
in Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
Pages: 645-652
Conference
17Th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2018, Date: 29 May 2018 through 1 June 2018, Sponsors: A.James Clark School of Engineering;Calce;et al.;Intel;Smart and Small Thermal Systems Laboratory (S2TS);University of Maryland
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Publication Identifiers
Scopus: 2-s2.0-85051063231
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