Thermal and Residual Stresses at the Emc-Silicon Interface: From Wafer Manufacturing to Fracture Test

AuthID
P-018-BD5
7
Author(s)
Videira, PFC
·
Akhavan-Safar, A
·
Maleki, P
·
Marques, EAS
·
Karunamurthy, B
·
Document Type
Article
Year published
2025
Published
in MATERIALS TODAY COMMUNICATIONS, ISSN: 2352-4928
Volume: 45, Pages: 112218 (11)
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Publication Identifiers
Scopus: 2-s2.0-105000438944
Wos: WOS:001452390900001
Source Identifiers
ISSN: 2352-4928
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