ProfileOfResearchers

TITLE: Design of an Anechoic Chamber for W-Band and mmWave Full Text
AUTHORS: Pedro Pinho; Hugo Santos ; Henrique Salgado ;
PUBLISHED: 2020, SOURCE: ELECTRONICS, VOLUME: 9, ISSUE: 5

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TITLE: Patch Antenna-in-Package for 5G Communications with Dual Polarization and High Isolation Full Text
AUTHORS: Hugo Santos ; Pedro Pinho; Henrique Salgado ;
PUBLISHED: 2020, SOURCE: ELECTRONICS, VOLUME: 9, ISSUE: 8

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TITLE: Dual-Polarized Patch Antenna-in-Package with High Isolation for Ka-Band 5G Communications
AUTHORS: Santos, HM ; Pinho, P; Salgado, HM ;
PUBLISHED: 2019, SOURCE: 2019 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference, IMOC 2019 in 2019 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference, IMOC 2019

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Scopus

TITLE: Meander-Line Monopole Antenna With Compact Ground Plane for a Bluetooth System-in-Package
AUTHORS: Hugo M Santos ; Pedro Pinho; Rui Pedro Silva; Marcio Pinheiro; Henrique M Salgado ;
PUBLISHED: 2019, SOURCE: IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, VOLUME: 18, ISSUE: 11

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TITLE: Scalable High-Gaussicity Split-Block Diagonal Horn Antenna for Integration with Sub-THz Devices
AUTHORS: Santos, HM ; Lima, ED ; Pedro Pinho; Pessoa, LM ; Moro Melgar, D; Salgado, HM ;
PUBLISHED: 2019, SOURCE: 49th European Microwave Conference (EuMC) in 2019 49TH EUROPEAN MICROWAVE CONFERENCE (EUMC)

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TITLE: Elliptical Monopole Antenna on InP Substrate for Sub-THz RTD-based Oscillators
AUTHORS: Santos, HM ; Pessoa, LM ; Salgado, HM ; Pedro Pinho;
PUBLISHED: 2018, SOURCE: IEEE-Antennas-and-Propagation-Society International Symposium on Antennas and Propagation / USNC/URSI National Radio Science Meeting in 2018 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION & USNC/URSI NATIONAL RADIO SCIENCE MEETING

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TITLE: Low-Density Fan-Out SiP for Wearables and IoT with Heterogeneous Integration
AUTHORS: Martins, A; Pinheiro, M ; Ferreira, AF; Almeida, R; Matos, F; Oliveira, J; Eoin O'Toole; Santos, HM ; Monteiro, MC; Gamboa, H ; Silva, RP;
PUBLISHED: 2018, SOURCE: International Wafer Level Packaging Conference (IWLPC) in 2018 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC)

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