Eduardo André de Sousa Marques
AuthID: R-000-SW7
1
TITLE: Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints Full Text
AUTHORS: Gutierrez Posada, V.; Akhavan Safar, A.; Simoes, B. D.; Carbas, R. J. C.; Marques, E. A. S.; da Silva, L. F. M.;
PUBLISHED: 2025, SOURCE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 36, ISSUE: 1
AUTHORS: Gutierrez Posada, V.; Akhavan Safar, A.; Simoes, B. D.; Carbas, R. J. C.; Marques, E. A. S.; da Silva, L. F. M.;
PUBLISHED: 2025, SOURCE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 36, ISSUE: 1
INDEXED IN: 
Scopus 
WOS
Scopus WOS2
TITLE: European adhesive bonder-a targeted training for portuguese professionals harmonized with european directives
AUTHORS: Barbosa, AQ; da Silva, LFM ; Loureiro, A; Marques, EAS; Carbas, R ; de Barros, S;
PUBLISHED: 2021, SOURCE: U.Porto Journal of Engineering, VOLUME: 7, ISSUE: 1
AUTHORS: Barbosa, AQ; da Silva, LFM ; Loureiro, A; Marques, EAS; Carbas, R ; de Barros, S;
PUBLISHED: 2021, SOURCE: U.Porto Journal of Engineering, VOLUME: 7, ISSUE: 1
3
TITLE: Influence of Ductility Ingredients of Structural Adhesives on Fracture Energy under Static Mixed-Mode Loading
AUTHORS: Nakada, S; Furusawa, T; Yokoi, E; Carbas, R ; Costa, M; Marques, E; Viana, G; da Silva, LFM ;
PUBLISHED: 2017, SOURCE: SAE World Congress Experience, WCX 2017 in SAE Technical Papers, VOLUME: 2017-March, ISSUE: March
AUTHORS: Nakada, S; Furusawa, T; Yokoi, E; Carbas, R ; Costa, M; Marques, E; Viana, G; da Silva, LFM ;
PUBLISHED: 2017, SOURCE: SAE World Congress Experience, WCX 2017 in SAE Technical Papers, VOLUME: 2017-March, ISSUE: March
