Publications

Wafer Reconstruction: An Alternative 3D Integration Process Flow

AuthID
P-009-BS2

Author(s)

Wang, T

Silva, JL

Daily, R

Capuz, G

Gonzalez, M

Rebibis, KJ

Kroehnert, S

Beyne, E

Document Type

Proceedings Paper

Year published

2013

Published

in Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013

Pages: 415-419

Conference

2013 Ieee 15Th Electronics Packaging Technology Conference, Eptc 2013, Date: 11 December 2013 through 13 December 2013, Location: Singapore, Sponsors: IEEE Components, Packaging and Manufacturing Technology Society (CPMT);SPIL Siliconware;CST

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