Wafer Reconstruction: An Alternative 3D Integration Process Flow

AuthID
 P-009-BS2
8
Author(s)
Wang, T
·
Silva, JL
·
Daily, R
·
Capuz, G
·
Gonzalez, M
·
Beyne, E
Tipo de Documento
Proceedings Paper
Year published
2013
Publicado
in Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Páginas: 415-419
Conference
2013 Ieee 15Th Electronics Packaging Technology Conference, Eptc 2013, Date: 11 December 2013 through 13 December 2013, Location: Singapore, Patrocinadores: IEEE Components, Packaging and Manufacturing Technology Society (CPMT);SPIL Siliconware;CST
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Publication Identifiers
SCOPUS: 2-s2.0-84897800912
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