Morphological and Structural Characteristics Presented by the Cu-Sn-Cu Metallurgical System Used in Electronic Joints

AuthID
 P-000-YZK
8
Author(s)
Fernandes, B
·
Goncalves, C
·
Marvao, AP
Document Type
Article
Year published
2000
Published
in MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, ISSN: 0921-5093
Volume: 288, Issue: 2, Pages: 248-252 (5)
Conference
Joint Fems Symposium/E-Mrs Symposium H Strain in Materials: Analysis, Relatation and Properties, Date: JUN 01-04, 1999, Location: STRASBOURG, FRANCE
Indexing
Wos®
Scopus®
Crossref®
Google Scholar®
Publication Identifiers
Scopus: 2-s2.0-0034273959
Wos: WOS:000088607600027
Source Identifiers
ISSN: 0921-5093
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