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Morphological and Structural Characteristics Presented by the Cu-Sn-Cu Metallurgical System Used in Electronic Joints

AuthID
P-000-YZK

Author(s)

Ferreira, J

Fernandes, B

Goncalves, C

Marvao, AP

Tipo de Documento

Article

Year published

2000

Publicado

in MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, ISSN: 0921-5093

Volume: 288, Número: 2, Páginas: 248-252 (5)

Conference

Joint Fems Symposium/E-Mrs Symposium H Strain in Materials: Analysis, Relatation and Properties, Date: JUN 01-04, 1999, Location: STRASBOURG, FRANCE

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Publication Identifiers

DOI: 10.1016/s0921-5093(00)00859-5

SCOPUS: 2-s2.0-0034273959

Wos: WOS:000088607600027

Source Identifiers

ISSN: 0921-5093

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Morphological and Structural Characteristics Presented by the Cu-Sn-Cu Metallurgical System Used in Electronic Joints

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