in Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
Pages: 645-652
Conference
17Th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2018, Date: 29 May 2018 through 1 June 2018, Sponsors: A.James Clark School of Engineering;Calce;et al.;Intel;Smart and Small Thermal Systems Laboratory (S2TS);University of Maryland