2 Phase Microprocessor Cooling System with Controlled Pool Boiling of Dielectrics over Micro-Andnano Structured Integrated Heat Spreaders

AuthID
P-00M-BZA
4
Author(s)
Document Type
Proceedings Paper
Year published
2016
Published
in 2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM) in Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ISSN: 1087-9870
Pages: 378-387 (10)
Conference
15Th Ieee Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm), Date: MAY 31-JUN 03, 2016, Location: Las Vegas, NV, Sponsors: IEEE, IEEE Components Packaging & Mfg Technol Soc
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Wos: WOS:000390436000055
Source Identifiers
ISSN: 1087-9870
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