S. Kroehnert
AuthID: R-00G-NEC
1
TITLE: Wafer reconstruction: An alternative 3D integration process flow
AUTHORS: Wang, T; Silva, JL; Daily, R; Capuz, G; Gonzalez, M; Rebibis, KJ; Kroehnert, S; Beyne, E;
PUBLISHED: 2013, SOURCE: 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 in Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
AUTHORS: Wang, T; Silva, JL; Daily, R; Capuz, G; Gonzalez, M; Rebibis, KJ; Kroehnert, S; Beyne, E;
PUBLISHED: 2013, SOURCE: 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 in Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
INDEXED IN: 
Scopus 
CrossRef
Scopus CrossRef