S. Kroehnert
AuthID: R-00G-NEC
1
TÃTULO: Wafer reconstruction: An alternative 3D integration process flow
AUTORES: Wang, T; Silva, JL; Daily, R; Capuz, G; Gonzalez, M; Rebibis, KJ; Kroehnert, S; Beyne, E;
PUBLICAÇÃO: 2013, FONTE: 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 in Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
AUTORES: Wang, T; Silva, JL; Daily, R; Capuz, G; Gonzalez, M; Rebibis, KJ; Kroehnert, S; Beyne, E;
PUBLICAÇÃO: 2013, FONTE: 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 in Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
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